IC datasheet pdf-RI-R6C-001A,pdf(HF Reader System Series 6000 S6700 Multi-Protocol Transceiver IC )(
RADIO FREQUENCY IDENTIFICATION SYSTEMS
HF Reader System Series 6000
S6700 Multi-Protocol Transceiver IC
The S6700 Multi Protocol Transceiver IC enables a broad range of 13.56MHz RFID interrogator designs for portable and stationary readers. This low power consumption device supports multiple RF communication protocols, minimizes onboard power requirements and reduces parts count in a final reader product.
Operating Frequency Supported RF Communication Protocols 13.56MHz -
Tag-it HF ISO 15693-2 (e.g. Tag-it HF-I) ISO 14443-2 (Type A) Transparent (directly switched according to input pin)
Operating Voltage Current Consumption
3.3V - 5V DC ± 10% Transmit: < 200 mA Stand-by: - Oscillator on < 15 mA - Oscillator off < 50 ?A 200mW at 5V DC operating voltage ASK, 10% to 100% selectable through external components 50 Ohm at 13.56MHz ASK 423.75kHz, ASK 847kHz, FSK 423.75kHz/484.29kHz selectable Serial interface, CMOS compatible -40°C to +85°C -55°C to +125°C SSOP 20 Tape-on-Reel, 1500 units per reel Recommended application schematic
Transmitter power Transmitter modulation Antenna Impedance Receive channels Communication Interface Operating Temperature Storage Temperature Package / Pincount Packing / Delivery
L3 R1 C1 C2 C3 C4
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol VDD_TX TX_OUT R_MOD VSS_TC XTAL1 XTAL2 VSS_DIG XTAL_CLK Not used Not used DOUT VDD_DIG DIN M_ERR SCLOCK Not used VDD_RX Not used VSS_RX RX_IN Description Transmitter power supply Output transistor drain connection External resistor to set 10% modulation depth mode Transmitter section ground Pin 1 of Xtal resonator Pin 2 of Xtal resonator, external clock input Digital section ground Buffered output of Xtal oscillator Grounded for normal operation Grounded for normal operation Data output for serial link Digital section power supply Data input for serial link Manchester Protocol error flag Serial link clock Leave open for normal operation Receiver section power supply Leave open for normal operation Receiver section ground Receiver input
VCC 1 L4 C5 C6 3 C7 R2 4 5 6 XTAL 13.56 MHz C9 8 9 10 7 2 20 19 18 C8 VSS_TX XTAL1 XTAL2 VSS_DIG XTAL_CLK SCLOCK M_ERR DIN VDD_DIG DOUT VDD_RX 17 16 VCC 15 14 13 12 11 ?C
VDD_TX TX_OUT R_MOD
C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 L1 L2 L3 L4 R1 R2
47pF 10pF 10nF 47pF 10?F Tantalum 100nF 22pF 100nF 22pF 100nF 2.7?H (Q-60) 2.7?H (Q-60) 5.6?H (Q-60) 3.3?H (Q-60) 2.2kΩ 18Ω
For more information, contact the sales office or distributor nearest you. This contact information can be found on our web site at: http://www.ti-rfid.com
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? Copyright 2002 Texas Instruments Incorporated. 11-07-22-001 09/02 SCBS856
PACKAGE OPTION ADDENDUM
Orderable Device RI-R6C-001A-03
Status (1) ACTIVE
Package Type TSSOP
Package Drawing DBT
Pins Package Eco Plan (2) Qty 20 1500 TBD
Lead/Ball Finish Call TI
MSL Peak Temp (3) Call TI
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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